功能介绍：
1.能通过Wi-Fi连接手机，让用户烹饪时远程操作
2.在锅的正面，有一个Wi-Fi灯、一个开关、一个温度灯。你能设置低、中、高三档。
3.设定好温度、时间，就可以离开厨房。app能够让你实时了解锅里食物的状况，包括已经烹饪了多久、还有多久结束、现在的温度是什么。你还能用app远程调节这些参数。
4.不锈钢的底座、6夸脱的可拆卸内胆、一个玻璃盖，盖上有锁定系统。
产品特性：
| PCB Layers | 1 Layers to 12 layer (standard), |
| PCB material/type | FR-1,FR-4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger |
| Assembly service type | DIP/SMT or Mixed SMT & DIP |
| Copper thickness | 0.5 OZ-5 OZ |
| Assembly surface finish | HASL, HASL Lead Free, ENIG, OSP |
| PCB Dimension | 600x1200mm |
| IC Pitch(min) | 0.2mm |
| Chip Size(min) | 201 |
| Leg distance(min) | 0.3mm |
| BGA Size | 8x6mm~55x55mm |
| SMT Efficiency | SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA |
| u-BGA ball dia. | 0.2mm |
| Required Docs for PCBA | Gerber file with BOM list & Pick-N-Place File(XYRS) |
| SMT speed | CHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs |
| Average hole wall copper | Thickness for HAL board:25um, Gold-finger plating:0.1um |
| Solder mask ink | photo cure ink, heat cure ink. UV ink. |
| Outline tolerance | ±0.1mm |
| Hole diameter tolerance | ±0.076mm |
| Hole location tolerance | ±0.076mm |
| V-CUT tolerance | ±0.1mm |
| Warp | According to the IPC-600F standard |
