产品特点:
1、复合加热:集辐射对流于一体,内部为高效铝合金散热翼,辐射能力强,辐射面积大;
2、经过对导流板和通风孔的严格理论计算,空气对流畅通无阻,温度迅速上升。
3、不锈钢外壳,结构紧凑,外形美观;防腐蚀,抗震动,防潮;
4、运行成本低,采用公司的智能控制系统,用电脑代替人脑进行行为节能,在均热效应的前提下达到理想的节能效果。
5、电能直接转化为热能,不仅节约了宝贵的不可再生资源,而且从根本上解决了管道系统运行,运行,滴漏,泄漏等问题。
6、罩盖表面也可静电喷涂使用者的各种颜色;
7、功率范围从600W到2000W,外形尺寸可根据用户要求定制;
8、绿色,有利于身心健康。
产品特性:
PCB Layers | 1 Layers to 12 layer (standard), |
PCB material/type | FR-1,FR-4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger |
Assembly service type | DIP/SMT or Mixed SMT & DIP |
Copper thickness | 0.5 OZ-5 OZ |
Assembly surface finish | HASL, HASL Lead Free, ENIG, OSP |
PCB Dimension | 600x1200mm |
IC Pitch(min) | 0.2mm |
Chip Size(min) | 201 |
Leg distance(min) | 0.3mm |
BGA Size | 8x6mm~55x55mm |
SMT Efficiency | SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA |
u-BGA ball dia. | 0.2mm |
Required Docs for PCBA | Gerber file with BOM list & Pick-N-Place File(XYRS) |
SMT speed | CHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs |
Average hole wall copper | Thickness for HAL board:25um, Gold-finger plating:0.1um |
Solder mask ink | photo cure ink, heat cure ink. UV ink. |
Outline tolerance | ±0.1mm |
Hole diameter tolerance | ±0.076mm |
Hole location tolerance | ±0.076mm |
V-CUT tolerance | ±0.1mm |
Warp | According to the IPC-600F standard |