产品介绍:
1.时尚外观,精致工艺;
2.手机远程控制,带预约功能;
3.具有防干烧断电的保护功能;
4.具有套餐、肉类、煲汤、米饭、甜品、快蒸、快煮和保温等功能;
5.隔水炖煮,原汁原味,保护食物营养;
6.采用发热盘发热,水快速烧开后功率减半,猛火煮沸,细火慢炖;
7.当温控器复位后,显示屏进入待机状态。
产品特性:
PCB Layers | 1 Layers to 12 layer (standard), |
PCB material/type | FR-1,FR-4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger |
Assembly service type | DIP/SMT or Mixed SMT & DIP |
Copper thickness | 0.5 OZ-5 OZ |
Assembly surface finish | HASL, HASL Lead Free, ENIG, OSP |
PCB Dimension | 600x1200mm |
IC Pitch(min) | 0.2mm |
Chip Size(min) | 201 |
Leg distance(min) | 0.3mm |
BGA Size | 8x6mm~55x55mm |
SMT Efficiency | SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA |
u-BGA ball dia. | 0.2mm |
Required Docs for PCBA | Gerber file with BOM list & Pick-N-Place File(XYRS) |
SMT speed | CHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs |
Average hole wall copper | Thickness for HAL board:25um, Gold-finger plating:0.1um |
Solder mask ink | photo cure ink, heat cure ink. UV ink. |
Outline tolerance | ±0.1mm |
Hole diameter tolerance | ±0.076mm |
Hole location tolerance | ±0.076mm |
V-CUT tolerance | ±0.1mm |
Warp | According to the IPC-600F standard |