产品介绍:
1.采用适当的MCU开发考虑到未来MCU处理能力和外围资源升级的便利性,选择一个大品牌,通用性强,以及不错的替代MCU
2.输入电源DC12V,1A使用12V 5A模块电源控制面板,等离子模块,负离子模块,紫外灯
3.带有掉电记忆功能的2K字记忆主要用于存储过滤时间信息和一些异常的环境信息
4.红外遥控器(遥控器和接收解码)红外遥控器按钮与控制面板上的按钮相匹配
5.无刷直流电机控制接口(PWM调速/电压调节0?5V)
6.调试接口,通过仿真器调试主控制器
7.传感器接口传感器:灰尘传感器(PM2.5 / PM10),气体污染物传感器
8.智能语音控制,语音提示
产品特性:
PCB Layers | 1 Layers to 12 layer (standard), |
PCB material/type | FR-1,FR-4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger |
Assembly service type | DIP/SMT or Mixed SMT & DIP |
Copper thickness | 0.5 OZ-5 OZ |
Assembly surface finish | HASL, HASL Lead Free, ENIG, OSP |
PCB Dimension | 600x1200mm |
IC Pitch(min) | 0.2mm |
Chip Size(min) | 201 |
Leg distance(min) | 0.3mm |
BGA Size | 8x6mm~55x55mm |
SMT Efficiency | SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA |
u-BGA ball dia. | 0.2mm |
Required Docs for PCBA | Gerber file with BOM list & Pick-N-Place File(XYRS) |
SMT speed | CHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs |
Average hole wall copper | Thickness for HAL board:25um, Gold-finger plating:0.1um |
Solder mask ink | photo cure ink, heat cure ink. UV ink. |
Outline tolerance | ±0.1mm |
Hole diameter tolerance | ±0.076mm |
Hole location tolerance | ±0.076mm |
V-CUT tolerance | ±0.1mm |
Warp | According to the IPC-600F standard |
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