产品介绍：
1、复合加热：集辐射对流于一体，内部为高效铝合金散热翼，辐射能力强，辐射面积大;
2、经过对导流板和通风孔的严格理论计算，空气对流畅通无阻，温度迅速上升。
3、不锈钢外壳，结构紧凑，外形美观;防腐蚀，抗震动，防潮;
4、运行成本低，采用公司的智能控制系统，用电脑代替人脑进行行为节能，在均热效应的前提下达到理想的节能效果。
5、电能直接转化为热能，不仅节约了宝贵的不可再生资源，而且从根本上解决了管道系统运行，运行，滴漏，泄漏等问题。
6、罩盖表面也可静电喷涂使用者的各种颜色;
7、功率范围从600W到2000W，外形尺寸可根据用户要求定制;
8、绿色，有利于身心健康。
9、智能身体红紫外线感应系统
产品特性：
| PCB Layers | 1 Layers to 12 layer (standard), |
| PCB material/type | FR-1,FR-4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger |
| Assembly service type | DIP/SMT or Mixed SMT & DIP |
| Copper thickness | 0.5 OZ-5 OZ |
| Assembly surface finish | HASL, HASL Lead Free, ENIG, OSP |
| PCB Dimension | 600x1200mm |
| IC Pitch(min) | 0.2mm |
| Chip Size(min) | 201 |
| Leg distance(min) | 0.3mm |
| BGA Size | 8x6mm~55x55mm |
| SMT Efficiency | SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA |
| u-BGA ball dia. | 0.2mm |
| Required Docs for PCBA | Gerber file with BOM list & Pick-N-Place File(XYRS) |
| SMT speed | CHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs |
| Average hole wall copper | Thickness for HAL board:25um, Gold-finger plating:0.1um |
| Solder mask ink | photo cure ink, heat cure ink. UV ink. |
| Outline tolerance | ±0.1mm |
| Hole diameter tolerance | ±0.076mm |
| Hole location tolerance | ±0.076mm |
| V-CUT tolerance | ±0.1mm |
| Warp | According to the IPC-600F standard |
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