1           

Layer                                                  

1-30Layers                                                                                

2

Base Material for PCB

FR4, CEM-1, TACONIC, Aluminium, High Tg Material, 

High Frequence ROGERS ,

TEFLON, ARLON, Halogen-free Material

3

Rang of finish baords Thickness

0.21-7.0mm

4

Max size of finish board

900MM*900MM

5

Minimum Linewidth

3mil (0.075mm)

6

Minimum Line space

3mil (0.075mm)

7

Min space between pad to pad

3mil (0.075mm)

8

Minimum hole diameter

0.10 mm

9

Min bonding pad diameter

10mil

10

Max proportion of drilling 

hole and board thickness

1:12.5

11

Minimum linewidth of Idents

4mil

12

Min Height of Idents

25mil

13

Finishing Treatment

HASL (Tin-Lead Free),  ENIG(Immersion Gold), 

Immersion Silver , Gold Plating (Flash Gold), OSP, etc.

14

Soldermask

Green, White, Red, Yellow, Black, Blue,

 transparent photosensitive soldermask, 

Strippable soldermask.

15

Minimun thickness of soldermask

10um

16

Color of silk-screen

White, Black, Yellow ect.

17

E-Testing

100% E-Testing (High Voltage Testing);  Flying Probe Testing 

18

Other test

ImpedanceTesting,Resistance Testing, Microsection etc.,

19

Date file format

GERBER FILE and DRILLING FILE, PROTEL SERIES, 

PADS2000 SERIES, Powerpcb SERIES, ODB++

20

Special technological requirement

Blind & Buried Vias and High Thickness copper

21

Thickness of Copper

0.5-14oz (18-490um)