产品介绍:
1,输入交流220V电压
2,三个按键定义ON / OFF,档位调整,负极ON / OFF;
3,4个LED灯指示不同的工作状态;
4,开机后经常按住3秒ON / OFF键进入工作状态,默认开机第一次工作,相应的LED会亮;
5,根据档位调节键,可以从1档到3档调节;
6,自动微处理器监控整个工作状态。
产品特性:
PCB Layers | 1 Layers to 12 layer (standard), |
PCB material/type | FR-1,FR-4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger |
Assembly service type | DIP/SMT or Mixed SMT & DIP |
Copper thickness | 0.5 OZ-5 OZ |
Assembly surface finish | HASL, HASL Lead Free, ENIG, OSP |
PCB Dimension | 600x1200mm |
IC Pitch(min) | 0.2mm |
Chip Size(min) | 201 |
Leg distance(min) | 0.3mm |
BGA Size | 8x6mm~55x55mm |
SMT Efficiency | SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA |
u-BGA ball dia. | 0.2mm |
Required Docs for PCBA | Gerber file with BOM list & Pick-N-Place File(XYRS) |
SMT speed | CHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs |
Average hole wall copper | Thickness for HAL board:25um, Gold-finger plating:0.1um |
Solder mask ink | photo cure ink, heat cure ink. UV ink. |
Outline tolerance | ±0.1mm |
Hole diameter tolerance | ±0.076mm |
Hole location tolerance | ±0.076mm |
V-CUT tolerance | ±0.1mm |
Warp | According to the IPC-600F standard |